Wafer Inspection Market Set to Approach $10 Billion by 2030
AUSTIN, Texas, Sept.
21, 2026 (GLOBE NEWSWIRE) -- AINewsWire Editorial Coverage : The artificial intelligence boom has moved its toughest bottleneck.
It is no longer just about who can etch the smallest transistor.
Increasingly, it is about who can package finished chips fast enough, cleanly enough and in high enough volume to keep AI data centers supplied.
NVIDIA CEO Jensen Huang has said publicly that the company is expanding capacity for CoWoS-L , the advanced packaging process behind its newest chips, while continuing to push suppliers on yield and production speed.
That same pressure is now rippling through the automation and inspection layer that supports packaging lines, an area where Nightfood Holdings Inc. (OTCQB: NGTF) ( profile ), doing business as TechForce Robotics , intends to compete.
Last week, the company announced the formation of TechForce Advanced Manufacturing, Inc., a majority-owned subsidiary built with a Taiwan-based manufacturing partner to expand production of automated Wafer Sorter and AOI systems for 8-inch and 12-inch wafers, with initial production and revenue targeted for the fourth quarter of 2026.
Nightfood is focused on joining other leaders who are operating in the broader AI/automation ecosystem, including NVIDIA Corporation (NASDAQ: NVDA), Advanced Micro Devices Inc. (NASDAQ: AMD), Broadcom Inc. (NASDAQ: AVGO) and Micron Technology Inc. (NASDAQ: MU).
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